MEMs Process and Development Engineer
Description -THIS POSITION IS OPEN TO MTI EMPLOYEES ONLY MEMs Process Development Engineer:HP Inc. is the leader in Inkjet Technology. We work to maintain this position while adding new technologies and innovative products to our portfolio. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on printing and imaging technologies as well as pursuing broader alternative technologies and research with an eye toward commercial applications. We are dedicated to providing advanced innovative solutions to our partners and customers.The MEMS section from the Print Microfluidics, Technology & Operations organization in Corvallis, Oregon is looking for an
experienced process engineer in one of these areas:
- Mechanical Engineering
- Material Science
- Electrical Engineering
- Chemical Engineering
The emphasis is to develop, characterize, and stabilize MEMS fabrication processes used for the production of inkjet components. Our fab uses a variety of processes to create fluidic features for thermal inkjet devices.
Responsibilities:This is an R&D Engineering position with a focus on packaging processes: precision over mold, pick-n-place, lamination, Wirebond, adhesive dispense, and automated handling. This position will work as a contributor to a diverse technical background of engineers collectively focused on delivering robust solutions to develop products that amaze our customers. You will support concept generation, process development, characterization, stabilization, and optimization.
- Be the engineering owner for a toolset and lead the technical team to maintain and improve process quality and cost
- Develop fundamental understanding of fabrication processes and product development methodologies
- Work with a team of engineers and technicians to develop reliable, cost-effective and high-quality solutions for complex products in a fast-paced New Product Introduction (NPI) environment
- Develop new methods and capabilities in the work center, in support of product development needs, quality improvements, and cost optimizations
- Collaborate and communicate with management, internal, and outsourced development partners regarding project progress and issue resolution
- Document and present project methods and results
Qualifications:- Bachelor's or Master's Degree in Material Science, Engineering (Mechanical, Chemical, Electrical, Microelectronics, Microsystems), or Physical Sciences (Chemistry, Physics) with a research topic related to silicon or MEMS processing
- 2 - 5 years of experience
- Interest or understanding of silicon or MEMS processing
- Demonstrated proficiency with CAD software
The base pay range for this role is $93,150 to $140,350 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits: HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -Engineering
Schedule -Full time
Shift -No shift premium (United States of America)
Travel -Relocation -No
Equal Opportunity Employer (EEO) - HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.If you'd like more information about HP's EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law - Supplement