Power Module Design Engineer - Nexus Semiconductor Recruitment : Job Details

Power Module Design Engineer

Location: Austin, Texas

Our client is at the forefront of developing groundbreaking bidirectional power switches, revolutionizing energy control for electric vehicles, EV charging, renewable energy, energy storage, data centers, solid-state circuit breakers, and more. Using their patented Bidirectional, Bipolar Junction Transistor (BJT) technology, they are redefining power semiconductor performance, significantly reducing losses, improving thermal management, and cutting operating costs.

About the Role

Are you a creative and driven Power Module Design Engineer passionate about pushing the boundaries of power semiconductor technology? This is your opportunity to design next-generation power packaging solutions that leverage advanced low-loss power technology. Ideal for a hands-on engineer eager to make a technical impact in the power semiconductor industry, you will lead the design, optimization, and development of high-performance power modules from concept to production.

Key Responsibilities

• Design & Development: Collaborate with cross-functional teams of device, process, and product engineers to design innovative power modules that meet electrical, mechanical, reliability, and cost targets.
• Simulation & Testing: Perform thermal, mechanical, and electrical simulations to validate designs and ensure compliance with industry standards.
• Leadership & Ownership: Take accountability for module designs, actively contributing to technology and product roadmaps and prioritizing development milestones.

Qualifications

• Master's or PhD in Electrical Engineering, Mechanical Engineering, or Solid-State Physics.
• 5+ years of experience in power semiconductor technology and product development.
• Proficiency in power semiconductor topologies, especially MOSFETs, IGBTs, and BJTs.
• Experience with CAD software (SolidWorks®, AutoCAD®, ProE) and simulation tools (COMSOL®, Ansys®).
• In-depth knowledge of power module reliability, failure modes, and next-gen packaging processes.

Apply now to be part of the innovation!