Staff Mechanical Engineer (Electronics Packaging) - Marotta : Job Details

Come grow with Marotta, named one of New Jersey's Top Workplaces for the third year running and a Top Workplace USA for 2024. You will have room to grow and be a part of an exciting team, all within a warm and welcoming environment.?? With compressed work week and hybrid work schedule options, Marotta values their employees.

We specialize in the design, development, and production of precision control components and systems. ?Founded in 1943, Marotta has been at the forefront of Aerospace & Defense milestones for over 80 years from breaking the sound barrier on the Bell X-1 and landing the first man on the moon to playing a critical role on today's advanced U.S Navy platforms as well as the emerging commercial Space industry.

Our products and expertise range from high performance valves to complete sub-systems that integrate electronic controls, actuators, and power conversion systems. We have received over 200 patents for our technologies and support the most demanding applications found on military aircraft, tactical systems, submarines, surface ships, satellites, and space launch vehicles. Our teams have repeatedly been recognized for outstanding performance by some of the most prestigious organizations in the world including The Boeing Company, Lockheed Martin, NASA & Northrop Grumman.

Staff Mechanical Engineer (Electronics Packaging)

Overview

The Electronics Packaging Mechanical Engineer is responsible for the physical design and construction of ruggedized electronics and ruggedized electronics enclosures. The Staff Engineer is responsible to complete and contribute to the design, development, testing, qualification, and production support of products in a cost effective and timely fashion to meet the customer's needs and schedules. The engineer shall work within a multi-disciplined organization and enlist the help of other disciplines when necessary, such as other engineers, manufacturing, purchasing, and quality assurance. Occasional light travel may be involved.

Primary Responsibilities:

* Design and development of ruggedized electronics and electronics enclosures from a blank sheet of paper to meet customer requirements through all phases of product life cycle. Typical tasks include:

* Preliminary CAD design of electronics / electronics enclosures

* Interface with electrical engineers to establish sizing of circuit card assemblies and selection of materials.

* Coordinate the creation of a preliminary bill of material in the business system and verifying its accuracy.

* Perform, or coordinate and review, preliminary analytical results (Hand calcs and/or FEA)

* Communicate technical and schedule problems, in a timely manner, to Engineering Manager / Director, Contracts Administrator, and Program Manager when applicable.

* Create/Review and Approve processes for assembly, test, and related activities to the development and qualification testing of a design.

* Design cost effective easily manufacturable hardware taking into account:

* tolerance stack-ups

* ease of assembly

* meet customer installation requirements

* materials of construction

* methods of manufacture

* mechanical environment (Thermal and Vibe) and Application Loading

* preliminary analytical results (Hand calcs and FEA)

* mistake proofing

* Create and modify drawings with appropriate GD&T, documentation of change and effectivity, verify bill of material Ensure accuracy of drawings.

* Disposition non-conforming hardware and assist with correcting production/vendor issues.

* Interface with internal and external customers to determine product changes needed for applications as a representative of the company.

* Write technical documents for internal and external customers.

* Participate in design reviews (internal and external)

* Lead failure investigations of designs as required.

* Support new business pursuits that address program technical requirements and associated schedule and costs.

* Mentor and Guide Junior team members

Qualifications/Knowledge/Skills Required:

* B.S. in Mechanical Engineering is required (Advanced technical degree desirable).

* 8+ years design experience and technical knowledge in mechanical engineering design of electronics packaging preferably in aerospace or defense industry.

* Ability to solve complex mechanical static & dynamic problems.

* Works precisely, accurately, and pays close attention to all details.

* High level of mechanical aptitude and knowledge.

* Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)

* Excellent verbal/written communication skills required for multi-faceted interactions with all levels of personnel within the organization, as well as all outside agents, including but not limited to, vendors, suppliers, customers, potential job candidates, etc.

* Highly computer literate, with MS Office/PC expertise, and demonstrated experience with applicable systems, programs, equipment, etc.

* Design experience with electronic packaging approaches for defense and aerospace applications including:

* Design for high shock and high vibration environments

* Design for challenging thermal conditions

* Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).

* Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.

* Knowledge of high voltage / altitude design practices at the board and box-level.

* Experience designing and testing designs to Mil-Std-810 Environments or similar (Humidity, Salt Fog, Vibration and Shock etc.)

* Experience with design for manufacturability

* Knowledge of manufacturing processes such as additive manufacturing, casting, milling, turning, grinding, drilling, etc.

* Knowledge of PWB and CCA fabrication

* Possess organizational and task management skills to work concurrent issues in parallel.

* Leadership skills to interface with various other teams and disciplines at the company.

* Must be a US Citizen

* Experience performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.

Work Environment and Physical Requirements:

* Position entails exposure to typical manufacturing (i.e. Machine Shop, Assembly, Testing, etc.) environments inclusive of the appropriate eye, hearing and foot protection (as required).

* Business office environment requiring use of telephone and personal computer

* Work under pressure and overtime when required, in order to meet deadlines

This position is at our Parsippany, NJ office location.

Many of our contracts require proof that you are a U.S. citizen and/or that an export license has been obtained for employees who are citizens of certain countries. Your employment, both initially and continually thereafter, is conditioned on production of such proof of citizenship and/or any export license that may be required to comply with any and all applicable laws, regulations, or executive orders, or required by Federal, State, or local government contracts.

We offer a highly competitive compensation package for this outstanding position plus a quarterly bonus along with a full range of top quality benefits and employee services including: medical, prescription, dental, vision, life and disability income insurance programs, 401k retirement plans with company match, generous tuition aid program, paid vacation, sick and personal days, paid holidays and flexible work hours with compressed work week options. We recognize and reward our employee's accomplishments and host several employee engagement events per quarter.

If you are looking to grow or accelerate your career and be part of a best in class organization while enjoying a work-life balance, please visit our website at www.marotta.com to learn more about us and to apply. Check out all of our openings at

We are an Affirmative Action and Equal Opportunity employer M/F/IWD/Veterans

VETERANS ARE ENCOURAGED TO APPLY